| Тип материала | Категория | Производитель |
|---|---|---|
| Andur 95-AP/Curene® 185 | PUR-Ether/TDI | Anderson Development Company |
| Andur 9500 APLF | PUR-Ether/TDI | Anderson Development Company |
| Andur 950 AP | PUR-Est/eth,TDI | Anderson Development Company |
| Xuchuan XWB-3320 | PUR, Unspecified | Xuchuan Chemical (Suzhou) Co., Ltd |
| Xuchuan 6680/B-8260 | PUR, Unspecified | Xuchuan Chemical (Suzhou) Co., Ltd |
| Baynat® 755 Isocyanate | PUR, Unspecified | Covestro - PUR |
| Beetafin® RV9010 | PUR-Ester | BIP (Oldbury) Limited |
| BCC Resins BC 8001 | PUR, Unspecified | BCC Products Inc. |
| BioSpan® SPU | PUR, Unspecified | DSM Biomedical Inc. |
| Bayfill® EA 6004 (5 pcf) | PUR-Ether/MDI | Covestro - PUR |
| Evermore PUR SW-1053A | PUR, Unspecified | Evermore Chemical Industry Co., Ltd. |
| Evermore PUR SW-8050H | PUR, Unspecified | Evermore Chemical Industry Co., Ltd. |
| Evermore PUR SS-1335N | PUR, Unspecified | Evermore Chemical Industry Co., Ltd. |
| Evermore PUR SA-390 | PUR, Unspecified | Evermore Chemical Industry Co., Ltd. |
| Generic PUR-Ether | PUR-Ether | Generic |
| Epoxies, Ect. 60-7114 | PUR, Unspecified | Epoxies, Etc. |
| Epoxies, Ect. 20-2160 | PUR, Unspecified | Epoxies, Etc. |
| Andur 8500 AP/Curene® 442 | PUR-Ether/TDI | Anderson Development Company |
| Huafon JF-A-WP1010 | PUR, Unspecified | Huafon Group Co., Ltd. |
| Huafon JF-S-8080A | PUR, Unspecified | Huafon Group Co., Ltd. |
| Huafon JF-P-8065 / JF-I-8815 | PUR-Ester | Huafon Group Co., Ltd. |
| HYDEX® 202 | PUR, Unspecified | Ensinger Inc. |
| PMC® 780 Dry/Wet | PUR, Unspecified | Smooth-On, Inc |
| TOYOBO Urethane A1061D | PUR-Butyl | TOYOBO America, Inc. |
| Andur 75 DGP 2/Curene® 442 | PUR-Ether/TDI | Anderson Development Company |
| Baydur® 665 IBS (30 pcf) | PUR-MDI | Covestro - PUR |
| Baytec® MS-052 (HQEE) | PUR-Ester/MDI | Covestro - PUR |
| Baytec® MP-090 (HQEE) | PUR-Ether/MDI | Covestro - PUR |
| Baytec® SPR-256D | PUR-Ether/MDI | Covestro - PUR |
| Huafon JF-P-2150 / JF-I-4118 | PUR-Ester | Huafon Group Co., Ltd. |
