FM® 300-2

FM® 300-2 film adhesive is a 250°F (121°C) cure version of Cytec Engineered Materials' widely used FM® 300 film adhesive. It delivers the same superior high temperature performance, toughness and stress/strain properties of FM 300 film adhesive without requiring a 350°F (177°C) cure cycle. In addition, FM 300-2 film adhesive's processing window includes temperatures up to 300°F (149°C) providing a unique level of flexibility from one adhesive product. FM 300-2 adhesive was developed specifically for co-cure and secondary composite bonding applications. Through innovative curative technology, the required cure temperature is reduced allowing for secondary bonding of structure far below the composite's glass transition point. FM 300-2 film adhesive also offers optimum flow control desirable for co-cure composite bonding. In metal bond applications, FM 300-2 film adhesive provides excellent moisture and corrosion resistance in high humidity environments with a minimal reduction in mechanical properties. To achieve consistent mechanical performance as well as maximum environmental resistance in bonding metallic details, the use of pre-cured BR® 127 corrosion inhibiting primer is recommended. FM 300-2 adhesive is available as an unsupported or supported film employing both knit and random mat carriers. A low-flow version of FM 300-2 film adhesive for composite interleaving, designated FM 300-2 interleaf adhesive, is also available.

Suggested Applications:
Co-cure and secondary composite bonding
Vacuum-only processing common in repair applications