Plaskon LS-16

Категория	Epoxy, Epoxy; Epoxide
Производитель	Cookson Electronics - Semiconductor Products
Торговая марка	Plaskon
Порт	Китай Шанхайский порт
Торговые условия	FOB, CFR, CIF
Платежное средство	L/C, T/T, Western Union
PDF	vRiEaG_Plaskon-LS-16.pdf
Контактная информация	EMAIL US  sales@su-jiao.com Служба поддержки клиентов Вичат

Описание материалов:

This material is a low stress molding compound specifically formulated for use with automated molding equipment to increase semiconductor manufacturing productivity and reduce production costs. This compound is recommended for molding of stress sensitive DIPs, SOICs, PLCCs and small QFPs.

Главная Информация
Характеристики	Полупроводникового Низкая вязкость Цикл быстрого формования Ускоренная Настройка Хорошая производительность формования
Формы	Жидкость
Метод обработки	Литье из смолы

Физический	Номинальное значение	Единица измерения	Метод испытания
Удельный вес	1.83	g/cm³	ASTM D792

Механические	Номинальное значение	Единица измерения	Метод испытания
Флекторный модуль	1.17	MPa	ASTM D790
Flexural Strength	0.0110	MPa	ASTM D790

Тепловой	Номинальное значение	Единица измерения	Метод испытания
Температура перехода стекла	152	°C	ASTM E1356
CLTE- Поток	1.7E-5	cm/cm/°C	ASTM D696

Электрический	Номинальное значение	Единица измерения	Метод испытания
Сопротивление громкости	9.5E+15	ohms·cm	ASTM D257
Диэлектрическая прочность	16	kV/mm	ASTM D149
Диэлектрическая постоянная (1 kHz)	3.30		ASTM D150
Коэффициент рассеивания (1 kHz)	3.0E-3		ASTM D150
Дуговое сопротивление	180	sec	ASTM D495

Воспламеняемость	Номинальное значение	Единица измерения	Метод испытания
Огнестойкость (3.18 mm)	V-0		UL 94
Индекс кислорода	30	%	ASTM D2863

Дополнительная информация
Recommended Storage Temperature: 5°CLife @ 5°C, defined as not more than 40% loss of spiral flow based on original values.: 24 monthsLife @ 21°C, defined as not more than 40% loss of spiral flow based on original values.: 5 daysLife @ 35°C, defined as not more than 40% loss of spiral flow based on original values.: 2 daysSpiral Flow, 175°C, 1000 psi: 51 cmAutomatic Orifice Viscosity, 165°C, Shear Rate is 68000 sec-1, 1 mm die length, 1/2 mm diameter: 18 Pascal secRam Follower Gel Time, 165°C, 1000 psi: 14 secAsh Content: 74.2 %Hydrolyzable Halides: <1 ppmCull Hot Hardness, Shore D, 75 sec, 165°C: 80Arc Resistance, 110v AC180 secThe following information was transfer molded and post cured for 2 hours at 165°C Glass Transition Temperature Tg: 162°C Linear Thermal Expansion, Alpha 1: 15.9 cm^-6/cm/°C Linear Thermal Expansion, Alpha 2: 66 cm^-6/cm/°C The following information was transfer molded and post cured for 2 hours at 175°C Glass Transition Temperature Tg: 165°C Linear Thermal Expansion, Alpha 1: 15.6 cm^-6/cm/°C Linear Thermal Expansion, Alpha 2: 67 cm^-6/cm/°C Thermal Conductivity15.7 cal/cm-sec-°C The following information was transfer molded and post cured for 4 hours at 165°C Glass Transition Temperature Tg: 150°C Linear Thermal Expansion, Alpha 1: 16.7 cm^-6/cm/°C Linear Thermal Expansion, Alpha 2: 61 cm^-6/cm/°C The following information was transfer molded and post cured for 4 hours at 175°C Glass Transition Temperature Tg: 152°C Linear Thermal Expansion, Alpha 1: 17.4 cm^-6/cm/°C Linear Thermal Expansion, Alpha 2: 64 cm^-6/cm/°C The following information was transfer molded and post cured for 15 minutes at 165°C Glass Transition Temperature Tg: 160°C Linear Thermal Expansion, Alpha 1: 16.5 cm^-6/cm/°C Linear Thermal Expansion, Alpha 2: 65 cm^-6/cm/°C The following information was transfer molded and post cured for 15 minutes at 175°C Glass Transition Temperature Tg: 162°C Linear Thermal Expansion, Alpha 1: 17.4 cm^-6/cm/°C Linear Thermal Expansion, Alpha 2: 67 cm^-6/cm/°C

Дополнительная информация

Recommended Storage Temperature: 5°CLife @ 5°C, defined as not more than 40% loss of spiral flow based on original values.: 24 monthsLife @ 21°C, defined as not more than 40% loss of spiral flow based on original values.: 5 daysLife @ 35°C, defined as not more than 40% loss of spiral flow based on original values.: 2 daysSpiral Flow, 175°C, 1000 psi: 51 cmAutomatic Orifice Viscosity, 165°C, Shear Rate is 68000 sec-1, 1 mm die length, 1/2 mm diameter: 18 Pascal secRam Follower Gel Time, 165°C, 1000 psi: 14 secAsh Content: 74.2 %Hydrolyzable Halides: <1 ppmCull Hot Hardness, Shore D, 75 sec, 165°C: 80Arc Resistance, 110v AC180 secThe following information was transfer molded and post cured for 2 hours at 165°C Glass Transition Temperature Tg: 162°C Linear Thermal Expansion, Alpha 1: 15.9 cm^-6/cm/°C Linear Thermal Expansion, Alpha 2: 66 cm^-6/cm/°C The following information was transfer molded and post cured for 2 hours at 175°C Glass Transition Temperature Tg: 165°C Linear Thermal Expansion, Alpha 1: 15.6 cm^-6/cm/°C Linear Thermal Expansion, Alpha 2: 67 cm^-6/cm/°C Thermal Conductivity15.7 cal/cm-sec-°C The following information was transfer molded and post cured for 4 hours at 165°C Glass Transition Temperature Tg: 150°C Linear Thermal Expansion, Alpha 1: 16.7 cm^-6/cm/°C Linear Thermal Expansion, Alpha 2: 61 cm^-6/cm/°C The following information was transfer molded and post cured for 4 hours at 175°C Glass Transition Temperature Tg: 152°C Linear Thermal Expansion, Alpha 1: 17.4 cm^-6/cm/°C Linear Thermal Expansion, Alpha 2: 64 cm^-6/cm/°C The following information was transfer molded and post cured for 15 minutes at 165°C Glass Transition Temperature Tg: 160°C Linear Thermal Expansion, Alpha 1: 16.5 cm^-6/cm/°C Linear Thermal Expansion, Alpha 2: 65 cm^-6/cm/°C The following information was transfer molded and post cured for 15 minutes at 175°C Glass Transition Temperature Tg: 162°C Linear Thermal Expansion, Alpha 1: 17.4 cm^-6/cm/°C Linear Thermal Expansion, Alpha 2: 67 cm^-6/cm/°C

Инструкции по впрыску
Auto Resin TransferMolding: Molding Temperature: 165 to 175°C Molding Pressure: 500 to 1000 psi Cycle Time, 175°C: 30 to 40 sec Cycle Time, 165°C: 40 sec Post Mold Cure Time, 175°C: 0 to 15 hr Post Mold Cure Time, 165°C: 0 to 15 hr

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