Категория | TP, Supersmooth, Extra-Clean, Crosslinkable Semiconductive Shielding Compound , TP, Unspecified |
Производитель | The Dow Chemical Company |
Торговая марка | Dow ENDURANCE™ |
Порт | Китай Шанхайский порт |
Торговые условия | FOB, CFR, CIF |
Платежное средство | L/C, T/T, Western Union |
nILkco_Dow-ENDURANCE-HFDA-0801-BK-EHV.pdf | |
Контактная информация | Служба поддержки клиентов Вичат |
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Формы |
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Физический | Номинальное значение | Единица измерения | Метод испытания |
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Удельный вес | 1.14 | g/cm³ | ASTM D792 |
Экологическое сопротивление растрескиванию (100% Igepal, F0) | > 504 | hr | ASTM D1693 |
Механические | Номинальное значение | Единица измерения | Метод испытания |
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Прочность на растяжение | 14.5 | MPa | ASTM D638 |
Удлинение при растяжении (Break) | 200 | % | ASTM D638 |
Старение | Номинальное значение | Единица измерения | Метод испытания |
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Прочность на растяжение- 1 неделя (150°C) | 98 | % | ASTM D638 |
Коэффициент удлинения- 1 неделя (150°C) | 90 | % | ASTM D638 |
Тепловой | Номинальное значение | Единица измерения | Метод испытания |
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Температура ломкости | -40.0 | °C | ASTM D746 |
Электрический | Номинальное значение | Единица измерения | Метод испытания |
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Сопротивление громкости | ASTM D991 | ||
23°C | 15 | ohms·cm | ASTM D991 |
90°C | 60 | ohms·cm | ASTM D991 |
130°C | 65 | ohms·cm | ASTM D991 |
Дополнительная информация |
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Nominal property values above represent tests on molded stress-relieved slabs. Cure times were 15 minutes at 175°C.Extra-Clean Requirements Among many desirable characteristics, DOW ENDURANCE™ HFDA-0801 BK EHV is extra-clean. DOW ENDURANCE™ HFDA-0801 BK EHV typically has less than 0.005% sulfur and less than 0.01% ash. The raw materials used for DOW ENDURANCE™ HFDA-0801 BK EHV are cleaner by design than those used for conventional semiconductive materials. Additional precautions are employed during the manufacture of DOW ENDURANCE™ HFDA-0801 BK EHV relative to conventional conductor shields to prevent introduction of any contamination to the raw materials and to the final product. These low levels of contamination can be expected to play a positive role in the manufacture of a totally extra-clean cable. Supersmooth Extruded Surface DOW ENDURANCE™ HFDA-0801 BK EHV meets the strictest standards of smoothness established for a crosslinkable semiconductive shield compound. The extruded surface of DOW ENDURANCE™ HFDA-0801 BK EHV must meet a smoothness specification that is more rigorous that typical supersmooth semiconductive shields. Throughout the production process, the product is tested to ensure smoothness. Extruded tapes are scanned by an automatic inspection system in a clean room. The tape smoothness data is managed using an acceptance sampling plan, which ensures that the shipping container meets or exceeds the product's smoothness standard. The DOW ENDURANCE™ HFDA-0801 BK EHV smoothness standard has been designed to meet the global industry specifications for semiconductive shield materials on high voltage and extra high voltage cables. Each batch of DOW ENDURANCE™ HFDA-0801 BK EHV meets the following smoothness requirement: Protrusion Height / Maximum Allowable 50-59 µm / 0 per m² 60-74 µm / 0 per m² >75 µm / 0 per m² Storage The environment or conditions of storage greatly influences the recommended storage time. Storage should be in accordance with good manufacturing practices. If proper warehousing and storage temperatures [dry conditions, between 50°F and 86°F (10°C and 30°C) in temperature] are utilized, this product may be stored by the customer for up to one year. It is recommended that the practice of using the product on a first-in / first-out basis be established. Storage under extreme conditions may affect the quality, processing, or performance of the product. |
Экструзия | Номинальное значение | Единица измерения | |
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Температура сушки | 60.0 - 70.0 | °C | |
Время сушки | < 6.0 | hr | |
Температура расплава | 121 - 140 | °C |
Инструкции по экструзии |
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DOW ENDURANCE™ HFDA-0801 BK EHV provides excellent surface finish and outstanding output rates over a broad range of conditions. For optimum results, use melt extrusion temperatures in the suggested range of 250 to 285°F (121 to 140°C) to avoid pre-cure or scorch. Extruder barrel settings of 110°C (230°F) are suggested as a starting point while learning to process DOW ENDURANCE™ HFDA-0801 BK EHV. Specific machine settings will depend on the extruder design and must be established through conventional practices.Dehumidified air hopper drying at 140-160°F (60-70°C) for up to six hours may be employed to remove residual moisture prior to extrusion. Drying is not necessary for DOW ENDURANCE™ HFDA-0801 BK EHV due to the lower moisture absorption characteristics relative to conventional semiconductive products. |
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Телефон | +086 13424755533 |
EMAIL US | sales@su-jiao.com |
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