Описание материалов:
FM® 57 film adhesive is a condensation polyimide adhesive supplied as a supported film with woven fiberglass carrier. FM 57 does not contain methylene dianiline (MDA). It is suitable for bonding metallic and non-metallic substrates as well as honeycomb structures. FM 57 film adhesive can be processed at 350°F (177°C) with a free-standing post-cure at 550°F (288°C). This adhesive film provides a service temperature of -67 to 550°F (-55 to 288°C) and can be used for repair and radar applications.
Suggested Applications:
Honeycomb sandwich construction
Metallic bonding
Non-metallic bonding
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Характеристики | |
Используется | |
Внешний вид | |
Формы | |
Механические | Номинальное значение | Единица измерения | |
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Прочность на растяжение 1 | | | |
24°C | 6.14 | MPa | |
177°C | 4.59 | MPa | |
Прочность сдвига | | | |
24°C 2 | 24.3 | MPa | |
24°C 3 | 24.8 | MPa | |
Примечание |
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1 . | Flatwise tensile, FM 57 film adhesive sandwich bonding |
2 . | FM 57 film adhesive on composite substrate |
3 . | FM 57 film adhesive on titanium substrate |