HTM® 552

HTM® 552 is a bismaleimide resin matrix formulation that combines high temperature end-use performance with good handleability during lay-up HTM552 has been developed for use in structures where critical load-bearing performance is required at temperatures greater than 200°C (392°F). In applications where components may be lightly loaded, intermittent periods at 250°C (482°F) can be sustained HTM552 is also capable of enduring very short-term exposure to a temperature of 280°C (536°F).