Тип материала | Категория | Производитель |
---|---|---|
Baytec® MP-101 | PUR-Ether/MDI | Covestro - PUR |
Andur 8500-AP/Curene® 185 | PUR-Ether/TDI | Anderson Development Company |
ADEKA YG-108 | PUR-Ester | Adeka Corporation |
ICORENE® N9702 | PUR-Ester | ICO Polymers EMEA, A Division of A. Schulman |
Smooth-Cast® 322 | PUR, Unspecified | Smooth-On, Inc |
Tool-A-Thane UT-605 | PUR, Unspecified | Urethane Tooling & Engineering Corp |
Xuchuan XCW-85N | PUR, Unspecified | Xuchuan Chemical (Suzhou) Co., Ltd |
Xuchuan XCW-6425DH | PUR, Unspecified | Xuchuan Chemical (Suzhou) Co., Ltd |
Xuchuan XCW-6050NC | PUR, Unspecified | Xuchuan Chemical (Suzhou) Co., Ltd |
Xuchuan XCS-15HN | PUR, Unspecified | Xuchuan Chemical (Suzhou) Co., Ltd |
Baynat® 755 Polyol | PUR, Unspecified | Covestro - PUR |
BJB Polyurethane TC-300 A/B | PUR, Unspecified | BJB Enterprises, Inc. |
BJB Polyurethane WC-792 A/B | PUR, Unspecified | BJB Enterprises, Inc. |
Evermore PUR SA-2052 | PUR, Unspecified | Evermore Chemical Industry Co., Ltd. |
Ebalta GM 984-2 / Comp. A+B | PUR, Unspecified | Ebalta Kunststoff GmbH |
Epoxies, Ect. 60-7114 | PUR, Unspecified | Epoxies, Etc. |
Andur 82 DGP/Curene® 442 | PUR-Ether/TDI | Anderson Development Company |
Andur 8-5 APLS/Curene® 442 | PUR-Ester/TDI | Anderson Development Company |
Andur 85 APLF/Curene® 442 | PUR-Ether/TDI | Anderson Development Company |
Andur M-22 (97% HQEE/ 3%TMP) | PUR-Ester/MDI | Anderson Development Company |
Huafon JF-D-NC8905 | PUR, Unspecified | Huafon Group Co., Ltd. |
Huafon JF-HSY-AD | PUR, Unspecified | Huafon Group Co., Ltd. |
LUVOCOM® 100-8633/BL | PUR, Unspecified | LEHVOSS Group |
Baynat® 0759 BX | PUR-MDI | Covestro - PUR |
Elastoskin® Lite 50555-05R Resin / S50555T Isocyanate | PUR, Unspecified | BASF Corporation |
Vibrathane® 8590 | PUR-Ester/MDI | Chemtura |
Baytec® ME-230 (74A) | PUR-Ether/MDI | Covestro - PUR |
Adiprene® LF 1950A | PUR-Ester/TDI | Chemtura |
Bayfit® SA 511 (95 Index) | PUR-MDI | Covestro - PUR |
CONAP® EN-5320 | PUR, Unspecified | Cytec Industries Inc. |