CORFIL® 658

CORFIL 658 is a one-part epoxy material designed for use in insert or edge filling of honeycomb structure. The low viscosity of CORFIL 658 makes it especially suitable for automated or hand filling of small cell sized honeycomb. The thixotropic nature of CORFIL 658 ensures that there is no slump or resin separation during cure. CORFIL 658 is shipped frozen in sealed metal pails or plastic tubes packed with dry ice or by refrigerated carrier.

FEATURES & BENEFITS
Excellent spreadability and extrudability
Compatible with most 350°F (177°C) curing epoxy prepregs
Good compressive strength

SUGGESTED APPLICATIONS
Filling of honeycomb core in sandwich structures, especially in co-bond or co-cure applications