Dyna-Purge® K

"Dual Power" cleaning for a broad range of low-temp resins

DYNA-PURGE K is a low-temperature, non-abrasive, non-chemical engineered thermoplastic purging compound, formulated to flow naturally through the machine. Two unique ingredients provide for a "dual power" cleaning experience. A non-melting but softening thermoplastic scrubs while a proprietary additive expands, removing any contamination without leaving behind a residue.

FEATURES & BENEFITS:

• Developed for color changes, resin changes, preventative machine maintenance, and before manual cleaning

• Excellent for purging through equipment with a minimum clearance of 0.025 inch (0.65 mm) or greater

• Effective through a wide range of temperatures - 290°F to 550° F (143°C to 287°C)

• Easy to use - no process adjustment necessary - use at the resident resin processing temperature and RPM speed

• Non-abrasive, non-melting but softening thermoplastic, which thoroughly loosens carbonized and degraded resin, allowing it to be flushed out of the system

• Safe, non-hazardous, with no chemicals - ingredients are FDA compliant

• Heat stable - recommended during shutdown and start-up

• Low "cost-per-purge" - only a small quantity is needed to be effective

• No mixing required - simply use "as is"

• Unlimited shelf life