Plaskon PPF-165

Категория	Epoxy, Epoxy; Epoxide
Производитель	Cookson Electronics - Semiconductor Products
Торговая марка	Plaskon
Порт	Китай Шанхайский порт
Торговые условия	FOB, CFR, CIF
Платежное средство	L/C, T/T, Western Union
PDF	NP707p_Plaskon-PPF-165.pdf
Контактная информация	EMAIL US  sales@su-jiao.com Служба поддержки клиентов Вичат

Описание материалов:

This material is a conventional epoxy molding compound specifically formulated for semiconductor devices which are molded with preplated leadframes. It increases semiconductor manufacturing productivity and reduces production costs.

Главная Информация
Характеристики	Полупроводникового Низкая вязкость Ускоренная Настройка
Формы	Жидкость
Метод обработки	Литье из смолы

Физический	Номинальное значение	Единица измерения	Метод испытания
Удельный вес	1.80	g/cm³	ASTM D792
Формовочная усадка- Поток	0.30	%	ASTM D955

Механические	Номинальное значение	Единица измерения	Метод испытания
Флекторный модуль	1.52	MPa	ASTM D790
Flexural Strength	0.0124	MPa	ASTM D790

Тепловой	Номинальное значение	Единица измерения	Метод испытания
Температура перехода стекла	130	°C	ASTM E1356
CLTE- Поток	2.1E-5	cm/cm/°C	ASTM D696

Электрический	Номинальное значение	Единица измерения	Метод испытания
Сопротивление громкости	5.0E+15	ohms·cm	ASTM D257
Диэлектрическая прочность	16	kV/mm	ASTM D149
Диэлектрическая постоянная (1 kHz)	3.50		ASTM D150
Коэффициент рассеивания (1 kHz)	3.0E-3		ASTM D150
Дуговое сопротивление	180	sec	ASTM D495

Воспламеняемость	Номинальное значение	Единица измерения	Метод испытания
Огнестойкость (3.18 mm)	V-0		UL 94
Индекс кислорода	30	%	ASTM D2863

Дополнительная информация
Recommended Storage Temperature: 5°CLife @ 5°C, defined as not more than 40% loss of spiral flow based on original values.: 24 monthsLife @ 21°C, defined as not more than 40% loss of spiral flow based on original values.: 5 daysLife @ 35°C, defined as not more than 40% loss of spiral flow based on original values.: 2 daysSpiral Flow, 165°C, 1000 psi: 72 cmSpiral Flow, 175°C, 1000 psi: 72 cmAutomatic Orifice Viscosity, 175°C, Shear Rate is 100000 sec-1, 1 mm die length, 1/2 mm diameter: 11 poiseAutomatic Orifice Viscosity, 165°C, Shear Rate is 100000 sec-1, 1 mm die length, 1/2 mm diameter: 17 Pascal secRam Follower Gel Time, 165°C: 18 secRam Follower Gel Time, 175°C: 12 secAsh Content: 72 %Hydrolyzable Halides: <1 ppmCull Hot Hardness, Shore D, 90 sec, 165°C: 80Cull Hot Hardness, Shore D, 90 sec, 175°C: 90Gangpot Hot Hardness, Shore D, 30 sec, 165°C: 70Arc Resistance, 110v AC180 secAll test specimens are transfer molded and post cured for 4 hours at 175°CThe following information was transfer molded and post cured for 15 minutes at 175°C Glass Transition Temperature Tg: 157°C Linear Thermal Expansion, Alpha 1: 21 cm^-6/cm/°C Linear Thermal Expansion, Alpha 2: 64 cm^-6/cm/°C The following information was transfer molded and post cured for 15 minutes at 165°C Glass Transition Temperature Tg: 157°C Linear Thermal Expansion, Alpha 1: 21 cm^-6/cm/°C Linear Thermal Expansion, Alpha 2: 67 cm^-6/cm/°C Thermal Conductivity14 cal/cm-sec-°C The following information was transfer molded and post cured for 30 seconds at 175°C Glass Transition Temperature Tg: 130°C Linear Thermal Expansion, Alpha 1: 21 cm^-6/cm/°C Linear Thermal Expansion, Alpha 2: 64 cm^-6/cm/°C The following information was transfer molded and post cured for 30 seconds at 165°C Glass Transition Temperature Tg: 135°C Linear Thermal Expansion, Alpha 1: 21 cm^-6/cm/°C Linear Thermal Expansion, Alpha 2: 67 cm^-6/cm/°C

Дополнительная информация

Recommended Storage Temperature: 5°CLife @ 5°C, defined as not more than 40% loss of spiral flow based on original values.: 24 monthsLife @ 21°C, defined as not more than 40% loss of spiral flow based on original values.: 5 daysLife @ 35°C, defined as not more than 40% loss of spiral flow based on original values.: 2 daysSpiral Flow, 165°C, 1000 psi: 72 cmSpiral Flow, 175°C, 1000 psi: 72 cmAutomatic Orifice Viscosity, 175°C, Shear Rate is 100000 sec-1, 1 mm die length, 1/2 mm diameter: 11 poiseAutomatic Orifice Viscosity, 165°C, Shear Rate is 100000 sec-1, 1 mm die length, 1/2 mm diameter: 17 Pascal secRam Follower Gel Time, 165°C: 18 secRam Follower Gel Time, 175°C: 12 secAsh Content: 72 %Hydrolyzable Halides: <1 ppmCull Hot Hardness, Shore D, 90 sec, 165°C: 80Cull Hot Hardness, Shore D, 90 sec, 175°C: 90Gangpot Hot Hardness, Shore D, 30 sec, 165°C: 70Arc Resistance, 110v AC180 secAll test specimens are transfer molded and post cured for 4 hours at 175°CThe following information was transfer molded and post cured for 15 minutes at 175°C Glass Transition Temperature Tg: 157°C Linear Thermal Expansion, Alpha 1: 21 cm^-6/cm/°C Linear Thermal Expansion, Alpha 2: 64 cm^-6/cm/°C The following information was transfer molded and post cured for 15 minutes at 165°C Glass Transition Temperature Tg: 157°C Linear Thermal Expansion, Alpha 1: 21 cm^-6/cm/°C Linear Thermal Expansion, Alpha 2: 67 cm^-6/cm/°C Thermal Conductivity14 cal/cm-sec-°C The following information was transfer molded and post cured for 30 seconds at 175°C Glass Transition Temperature Tg: 130°C Linear Thermal Expansion, Alpha 1: 21 cm^-6/cm/°C Linear Thermal Expansion, Alpha 2: 64 cm^-6/cm/°C The following information was transfer molded and post cured for 30 seconds at 165°C Glass Transition Temperature Tg: 135°C Linear Thermal Expansion, Alpha 1: 21 cm^-6/cm/°C Linear Thermal Expansion, Alpha 2: 67 cm^-6/cm/°C

Инструкции по впрыску
Conventional Resin TransferMolding: Preheat Temperature: 85 to 95°C Molding Temperature: 165 to 175°C Molding Pressure: 500 to 1000 psi Cycle Time, 175°C: 30 to 60 sec Cycle Time, 165°C: 60 to 90 sec Cure Time, 177°C: 0 to 15min Post Mold Cure Time, 175°C: 0 to 15 hr Gangpot Resin TransferMolding: Preheat Temperature: 165°C Molding Temperature: 35 to 70°C Molding Pressure: 500 to 1000 psi Cycle Time, 175°C: <30 sec Cycle Time, 165°C: 40 sec Post Mold Cure Time, 175°C: 0 to 15 hr Post Mold Cure Time, 165°C: 0 to 15 hr

Инструкции по впрыску

Conventional Resin TransferMolding: Preheat Temperature: 85 to 95°C Molding Temperature: 165 to 175°C Molding Pressure: 500 to 1000 psi Cycle Time, 175°C: 30 to 60 sec Cycle Time, 165°C: 60 to 90 sec Cure Time, 177°C: 0 to 15min Post Mold Cure Time, 175°C: 0 to 15 hr Gangpot Resin TransferMolding: Preheat Temperature: 165°C Molding Temperature: 35 to 70°C Molding Pressure: 500 to 1000 psi Cycle Time, 175°C: <30 sec Cycle Time, 165°C: 40 sec Post Mold Cure Time, 175°C: 0 to 15 hr Post Mold Cure Time, 165°C: 0 to 15 hr

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