KYOCERA KE-300K

Achieved Fast Cure for In-Line Process as well as Excellent Fillings and Applicable from Insertion Type to Surface Mount Type.

Strong Points

• Achieve Good and Necessary Filling in KE-520Series to Apply to Ultra Small Packages.

• JEDEC level 1 is Possible in Ultra Small Packages.

• Good Adhesion Strength Even after High Temperature Reflow Soldering Process.

• Fast Cure Enabling High Productive In-Line Auto Process.

• Excellent moldability and show improvement in moldability yield.

Application

• Surface Mount Device

• TO-92 Type (Insertion Type)

• Ultrasmall PKG