BCC Resins HPX-850

HPX-850 is a light weight, heat resistant, two component epoxy backfill system. Like BC 7020, the filler portion is pre-blended into the resin and hardener components for easier handling, thus simplifying the mixing process. HPX-850 features advantages such as low cost, long pot life, machineability, and low shrinkage. It is ideally suited for numerous applications involving mold and core constructions.

HPX-850 can be removed from the mold after allowing to set 24 hours @ room temperature (75°F). Post cure for applications requiring temperatures above 150°F can be accomplished in an oven or in use by a gradual heat rise; 2 hours @ 150°F, plus 2 hours @ 250°F, plus 2 hours at 300°F.