NORYL™ SA90 resin

NORYL SA90 resin is a modified low molecular weight resin with increased hydroxyl functionality. It is designed specifically for use as a reactive component in epoxy and cyanate ester thermosets in electronic, coatings, adhesives, and composites applications. It has outstanding solubility in toluene & methyl ethyl ketone (MEK) and a low solution viscosity. Targeted application areas are in enhancing the performance (e.g. thermal, dielectric, mechanical, flame retardancy, and moisture uptake properties) of epoxy resins used in electronic packaging which include PCB laminates, copper clad laminates, epoxy prepregs, and protective coatings as well as various other composites applications.