Описание материалов:
This material is an epoxy Molded UnderFill compound developed for transfer mold equipment to underfill, and overmold if needed, Flip Chip in Package (FC-BGA and FC-CSP) in one step. It offers high productivity with an automated, simple, robust and fast process compared to liquid encapsulation. Higher reliability is demonstrated with the material's higher Tg, lower CTE, no particle segregation or settling and longer outlife compared to liquid encapsulants. PLASKON? MUF is the total molded underfill solution for Flip Chip in Package.
| Главная Информация | |
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| Характеристики | - Полупроводникового
- Низкий уровень защиты
- Обрабатываемость, хорошая
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| Формы | |
| Метод обработки | |
| Физический | Номинальное значение | Единица измерения | Метод испытания |
|---|
| Удельный вес | 2.00 | g/cm³ | ASTM D792 |
| Механические | Номинальное значение | Единица измерения | Метод испытания |
|---|
| Флекторный модуль | | | ASTM D790 |
| 22°C | 2.45 | MPa | ASTM D790 |
| 260°C | 0.0686 | MPa | ASTM D790 |
| Flexural Strength | | | ASTM D790 |
| 22°C | 0.0132 | MPa | ASTM D790 |
| 260°C | 0.00127 | MPa | ASTM D790 |
| Тепловой | Номинальное значение | Единица измерения | Метод испытания |
|---|
| Температура перехода стекла | 135 | °C | ASTM E1356 |
| CLTE-
Поток | 9.0E-6 | cm/cm/°C | ASTM D696 |
| Теплопроводность | 0.70 | W/m/K | ASTM C177 |
| Воспламеняемость | Номинальное значение | | Метод испытания |
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| Огнестойкость (3.18 mm) | V-0 | | UL 94 |
| Дополнительная информация |
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| Recommended Storage Temperature: 5°CLife @ 5°C, defined as not more than 40% loss of spiral flow based on original values.: 24 monthsLife @ 21°C, defined as not more than 40% loss of spiral flow based on original values.: 5 daysLife @ 35°C, defined as not more than 40% loss of spiral flow based on original values.: 2 daysSpiral Flow, 175°C, 1000 psi: 160 cmShimadzu Viscosity, 175°C, 1000 psi: 30 poiseRam Follower Gel Time, 175°C, 1000 psi: 25 secAsh Content: 87.5 %Hydrolyzable Halides: <1 ppmMoisture Absorption, 85°C/85%RH, 168 hrs: 0.25%Filler Size, Max in traces: 40 µFiller Size, average: 6 µCull Hot Hardness, Shore D: 65All test specimens are transfer molded and post cured for 4 hours at 175°C
Linear Thermal Expansion, Alpha 1: 9 cm^-6/cm/°C
Linear Thermal Expansion, Alpha 2: 40 cm^-6/cm/°C |
| Инструкции по впрыску |
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| Resin Transfer Molding:
Molding Temperature: 165 to 185°C
Molding Pressure: 1000 psi
In Mold Cure Time: 50 to 100 sec
Post Mold Cure Time, 175°C: 0 to 2 hr |
